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DISCO Dicing Saw Seminar

Patterned silicon wafer cut into individual dies.

12.07.22Ìý

ESB 001

1:30-4:00 PM

Please join us to learn about the capabilities of the DISCO DAD3220 dicing saw in 91³Ô¹Ï꿉۪s VINSE cleanroom.  Representatives from DISCO will provide an overview of dicing applications and techniques. Dicing is a standard microfabrication process to create custom-sized substrates and devices for a variety of electronic, optical, biomedical, and other applications.  Silicon, sapphire, and fused quartz are commonly diced, but other materials may be available.

In addition, there will be a tour of the VINSE cleanroom and chance to meet the staff for discussion of dicing and other projects.